Lead Engineer, Rigetti Computing; Materials Focus Area Team Member, SQMS
Areas of Expertise: Materials Science
Feyza Oruc is working for SQMS as a Materials Focus Area Team Member assisting the INFN team with the Indium bump bonding process of KID chips. She earned her B.S. and M.S. degrees from Bilkent University/Electrical and Electronics Engineering Department. She currently works at Rigetti Computing as a Lead Engineer responsible for process integration and packaging.